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By utilizing the properties of PN junction barrier capacitor, a technology for passive device integration(PDI) on silicon is presented. Accurate high density capacitors, coils, resistors and trough wafer interconnect enable the realization of a highly miniaturized the consumer-oriented connectivity applications module without surface mounted devices (SMDs). The three-dimensional (3D) PN junction structure...
In this paper, a group of coplanar lines on a silicon dioxide insulating layer on a nominally doped silicon substrate is simulated and measured. Electrical parameters extracted from published data are used and lead to substantially improved agreement with measurements. In addition, several models of redistribution layer (RDL) with different shape-TSVs (through silicon vias) are simulated, along with...
Due to the differences in the thermal expansion coefficients of copper and silicon, a large thermal stress develops at the interface between a Cu-filled via and both the insulation layer and the surrounding silicon when the structure is subjected to temperature loading. In this paper four TSV geometries are considered in an effort to investigate the role of via geometry on stress relief. Thermo-mechanical...
This paper introduces two filtering methods in virtual environments, VON and UFR. By comparing the performance of the two kinds of methods with simulation programs, results show that UFR has better performance than the VON and other original “strip” algorithm.
A three-dimensional (3D) PN junction capacitor for passive device integration (PDI) on silicon is discussed in this paper. The embedded capacitor with low parasitic inductor and high-reliability structure is a key technology for achieving effective micro-system integration for embedded passive technology and is widely used for a broad range of applications including filtering, tuning and power-bus...
The coefficient of thermal expansion (CTE) of metal (e.g., copper, tungsten and solder) filled in through silicon via (TSV) is a few times higher than that of silicon. Thus, when the metal filled TSV is subjected to temperature loadings, there is a very large local thermal expansion mismatch between the metal and the silicon/dielectric (e.g., Si02), which will create very large stresses at the interfaces...
In this paper, the robot is a maze robot. Dijkstra algorithm is used in the robot path planning. The shortest path is selected in the process of barrier. Simulation results prove the model valid; it can effectively solve the maze robot path planning.
This paper proposes the combination of cloud computer and internet of things, and introduces the combination ways of cloud computing and internet of things. Finally, an anticipation is made at prospect of combination of cloud computing and internet of things.
Rapidly growing performance and mixed-signal integration is driving the need for product component miniaturization in electronics applications. Embedded passive technology is a potentially attractive solution to replace discrete passives. Embedded capacitors are widely used for broad range of applications including filtering, tuning and power-bus decoupling in the substrate. Micro-Electron-Mechanical...
Objective: To investigate the effects of low frequency whole body vibration on preventing the bone loss of rats' lower limbs induced by tail suspended. Method: 40 male rats were divided randomly into 4 groups, including tail suspended group(sus, n=10), tail suspended + ground stimulus group (s+g, ground stimulus: 30min/d, 5d/w, n=10), tail suspended + vibration group (s+v, vibration stimulus: 45Hz,...
This paper discusses a novel quasi-three-dimensional PN Junction capacitor, which has a high density of capacitance (200nF/cm2) with a relatively high working frequency (3GHz). These properties are because of its unique trench structure. To identify the performance of this kind of capacitor, some tests were carried out at both low frequency and high frequency. Moreover, a typical power supply filter...
The union of all shortest path trees GUspt is the maximally observable part of a network when traffic follows shortest paths. Overlay networks such as peer to peer networks or virtual private networks can be regarded as a subgraph of GUspt. We investigate properties of Gcupspt in different underlying topologies with regular i.i.d. link weights. In particular, we show that the overlay GUspt in...
Transport in large networks follows near to shortest paths. A shortest path depends on the topology as well as on the link weight structure, While much effort has been devoted to understand the properties of the topology of large networks, the influence of link weights on the shortest path received considerably less attention. The scaling of all link weights in a graph by a positive number does not...
When transport in networks follows the shortest paths, the union of all shortest path trees Gcupspt can be regarded as the "transport overlay network". Overlay networks such as peer-to-peer networks or virtual private networks can be considered as a subgraph of Gcupspt. We construct two types of Gcupspt: (a) Gcupspt(alpha) where alpha is the extreme value index of polynomial link weights...
Suturing and knot tying, an important part of a surgery, is the most universal wound closure method. As surgical robots are wide used clinically, more and more attention has paid to the study of robot assistant knot tying. The traditional robot assistant knot tying of the suture is completed with one tool leading the suture to circle around the other tool to form a suture loop. This approach can be...
Dry point of aviation kerosene in the atmospheric distillation column is a very important process value for quality controlling. But unfortunately few on-line hardware sensors are available to this value or such sensors are difficult to maintain. This paper adopts a novel method based on least squares support vector machine (LS-SVM) regression to implement on-line estimation of aviation kerosene dry...
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