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In this paper, Sn–3.5Ag solder bumps were prepared using multilayer electroplating method. The effect of electroplating layer structure (Sn/Ag, Ag/Sn, Ag/Sn/Ag) on shear property and microstructure of solder bumps was investigated.Shear test revealed that Sn/Ag bumps displayed the highest shear strength among different electroplating layer structures, which was 89.3% higher than that of pure Sn bumps,...
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