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Pull tensile test is commonly used to evaluate the bonding strength. But it is time-consuming using glue to attach the fixtures (jigs). In this paper, a novel method for bonding strength evaluation without using glue is developed based on the principles of the material mechanics and fracture mechanics. After two specimen are bonded by a cross structure, the pulling forces are applied at the relevant...
Because of the complicated configuration in MEMS devices, significant technical challenges are presented for the interconnection of dissimilar materials. Since tin soldering is an effective method for joining dissimilar materials, there are still some reliability problems in later service process, such as remelting of Sn solder, excessive microstructure evolution. In the present work, a parallel gap...
Prediction of solder joint geometry is one of key steps for achieving accurate alignment in optoelectronic packaging. An improved modeling is developed to predict the solder joint geometry. The wetting angle of molten solder in pad as well as that out of pad is taken into account in this model. Therefore, the molten solder geometry overflowed pads can be successfully predicted. The simulation result...
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