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Wafer direct bonding is a generic tool enabling realization of innovative structures. To expand the applications, an ideal bonding method is expect to achieve sufficient bonding strength at room temperature without requiring annealing, low-cost without high-vacuum system and facile treatment process. In this paper, a novel and simple wafer direct bonding process using fluorine containing plasma activation...
Prediction of solder joint geometry is one of key steps for achieving accurate alignment in optoelectronic packaging. An improved modeling is developed to predict the solder joint geometry. The wetting angle of molten solder in pad as well as that out of pad is taken into account in this model. Therefore, the molten solder geometry overflowed pads can be successfully predicted. The simulation result...
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