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In this work, ACA was prepared by mixing micro-sized spherical Ag particles and latent curing agent into thermo-set epoxy resin, and RFID flip chips were assembled on the Al/PET, printed Ag/PET and printed Ag/paper antennae through hot-press bonding process. The contact resistance and shear bonding strength before and after the reliability tests (hot humidity test, 85degC, RH 85%), and degradation...
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