The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper proposes a parametric simulation plan for UBM geometry with different UBM rim angles, diameters and thicknesses. The parameter plan for the solder bump with different heights and diameters, and different shapes is also investigated. The goal of this study is to understand the impact of the die shrinkage on solder joint reliability under electromigration failure, and to optimize the UBM...
This paper studies the numerical simulation method for electromigration in the solder joint of a chip scale package. The three dimensional electromigration finite element model for solder joint reliability is developed. Numerical experiments are carried out to obtain the electrical, thermal and stress fields with the migration failure under high current density loads. The indirect coupled analysis...
A series of tensile tests for Pb-free solder material 95.7Sn3.8Ag0.5Cu have been conducted under a wide range of temperatures and constant strain rates to obtain the required data for fitting the material parameters of Anand model. Based on these test results, empirical equations of the tensile strength, elastic modulus and yield stress are fitted as the functions of temperature. It is found that...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.