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The failure ratios of the three typical time-dependent dielectric breakdown (TDDB) failure modes, including top interface, sidewall and bottom corner areas, have been identified for a direct polishing ultra low k (ULK) dielectric Cu back-end-of-line (BEOL) structure at 40nm node. The Cu surface roughness of the metal lines, and the adhesion and thickness of the metal capping layers are strongly correlated...
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