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In order to study the effect of rare earth doping on temperature cycle (TC) and drop reliabilities of the SnAgCu solder joints, cerium (Ce) was added to Sn2.5AgO.5Cu solder by the amount of 300, 500, 1000 ppm, respectively. Solder joints were formed. TC and drop tests were conducted. Results show that 500 ppm Ce addition has the least influence on TC reliability of the solder joints, while less or...
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