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QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages. Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced...
Epoxy Molding Compound (EMC) is the encapsulation material that can provide mechanical support and protection to IC packages. In the meantime, it is also a key contributor to package warpage. Finite element analysis (FEA) has been widely used in packaging development to improve product performance more efficiently. EMC is usually modeled as piecewise linear elastic material in FEA model for simplification...
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