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The Integrated Fan Out (InFO) technology can accom-plish package miniaturization and successfully achieve “More than Moore's Law.” Its substrate-free technology also brings great cost-effective attraction to mobile and wearable applications. Ultra-thin integrated passive devices (IPDs) with high capacitance density can further shrink the InFO size and boost the bandwidth. Although the cost for the...
Reliability analysis is performed for various redistribution layer (RDL) interconnect patterns. Five different RDL patterns are designed to examine die pitch, line length, line width, dummy block, and die edge/corner effects on RDL reliability. Temperature dependent material properties, grain growth induced stress, thermal mismatch stress, and plastic deformation evolution are taken into consideration...
A three-step model used for modeling and simulation of black silicon formation in DRIE (Deep Reactive Ion Etching) process is presented. It divides the plasma etching system into plasma layer, sheath layer and sample surface layer. At the same time, it combines quantum mechanics, sheath dynamics and diffusion theory together based on plasma environment to predict the probability distribution of etching...
The spatial components included in complex-valued functional magnetic resonance imaging (fMRI) data are generally assumed to be noncircular signals. In this paper, we try to quantitatively investigate the noncircularity of fMRI with a measure called the degree of impropriety (DOI). Two semi-blind complex ICA algorithms, the kurtosis maximization (KM) algorithm suitable for separating noncircular sources...
A novel flame retardant, Si‐E, was synthesized and characterized by nuclear magnetic resonance (NMR). The flame retardancy of Si‐E in polypropylene/ammonium polyphosphate (PP/APP) composites was studied by limited oxygen index (LOI) and cone calorimeter (CONE). The influence of the flame retardant additives on the thermal degradation process in PP composites was ascertained by Fourier transform infrared...
Vanadium oxide(VOx) is one kind of mixture with different valences, and in addition to vanadium dioxide(VO2), the optical properties of other vanadium oxidations with different valences get few attention. In the present study, VOx thin film was grown on silicon substrates by direct current facing targets magnetron sputtering. VOx thin film was characterized by XPS (X-ray photoelectron spectroscopy)...
The fabrication of through-silicon vias (TSVs) is a major component in the development of three-dimensional (3D) integration technology and advanced 3D packaging approaches. The large diameter and length of TSVs, as compared to traditional interconnects, create some unique process challenges. Via plating and chemical-mechanical polishing (CMP) processes used in standard copper interconnect technology...
Significant consumption and cost savings can be made by better managing energy usage within small commercial properties and individual dwellings. By combining Web services and off-the-shelf home automation equipment, it is now possible to build a cost-effective infrastructure to support the delivery of energy management services to small consumers. In this paper we treat residential energy management...
The through-silicon via is a key element in the development of 3D integration technology for new generations of advanced electronic systems. There are several challenges associated with filling these deep, relatively large diameter vias using standard copper electroplating processes, like those common in damascene technology. This paper will summarize a process development for copper electroplating...
Cu pillars have been adopted and implemented in high volume manufacturing environment as early as 2006 as a replacement for high lead bumps. It is not only lead-free, but also offers the added advantage of higher stand-off, finer pitch capability and better electromigration resistance compared to tin-lead solder bumps. Cu pillar technology promises to be one of the main interconnect technologies in...
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