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In this paper, the shear behavior of solder joints in BGA package structure was studied by test. The four kinds of solder joints used in the research are Sn-3Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.07La and Sn-0.3Ag-0.7Cu-0.07La-0.05Ce. The influence law of the assembly sequence on the mechanical properties of the solder joints under board-level structure were analyzed. At the same time, the fracture...
This paper mainly studies the influence of loading rate on the shear mechanical properties of BGA solder joints, four kinds of solders (SAC305, SAC0307, SAC0307-0.07La and SAC0307-0.07La-0.05Ce) were prepared by means of experiment. The results show that the shear strength of the solder joints in the single board structure was increased with the increase of shear rate, but the shear strength of high-silver...
In this paper, four kinds of solder-SAC305, SAC0307, SAC0307-0.07La and SAC0307-0.07La-0.05Ce were prepared by experiment. The BGA solder joints (whose diameter is 900µm) of board-level structure was obtained by twice reflow soldering. We analyzed the shear strength, the fracture mode, and the fracture mechanism by applying shear load. At the same time, the effect of the thickness and morphology of...
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