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Mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy, before and after isothermal aging at 100 °C for 200 h, were investigated. Results show that the grain coarsening occurs in the Sn-58Bi solder alloy with prolonging the isothermal aging time, and the lamellar microstructure of the Sn-58Bi alloy is changed, in which the Bi-rich phase exhibits network-like morphology...
We introduce the concept of electrophobic interaction, analogous to hydrophobic interaction, for describing the behavior of impurity atoms in a metal, a “solvent of electrons”. We demonstrate that there exists a form of electrophobic interaction between impurities with closed electron shell structure, which governs their dissolution behavior in a metal. Using He, Be and Ar as examples, we predict...
The dynamic wetting behavior and formation of solder ball spattering of Sn-58Bi solder paste on Cu substrate during reflow soldering process were studied by the soldering interrupt test method; meanwhile, the formation mechanism of solder ball spattering was analyzed. Further, the effect of reflow process parameters on the severity of solder ball spattering defect during reflow soldering process was...
A novel impedance matching method of a helix antenna is proposed in this paper. The conventional impedance matching of a helix antenna is based on the method of adjusting the thickness of the substrate and making a tapered transition between the helix antenna and the coaxial cable. However, these methods are not easy to be controlled. This paper designed an improved impedance matching method, using...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
Among the lead-free solders used in the electronic industry, Sn-Bi based alloys have been largely considered for low temperature soldering applications due to low melting-point feature and good wettability resulting from Bi addition which can reduce the surface tension of liquid solders and lower the reaction speed between Sn and Cu. In this paper, the phase field simulation method was adopted to...
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