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The optimization of grinding parameters for silicon wafers is necessary in order to maximize the reliability of electronic packages. This paper describes the work performed to simulate a back grinding process for Through Silicon Via (TSV) wafers using the commercial finite element code ABAQUS. The grinding of a TSV silicon wafer with a thickness of 120 μm mounted on a backing tape was simulated. The...
Microneedle-based drug delivery has shown considerable promise for enabling painless transdermal and hypodermal delivery of conventional and novel therapies. However, this promise has yet to be fully realized due in large part to the limitations imposed by the micromechanical properties of the material systems being used. In this paper, we demonstrate titanium-based microneedle devices developed to...
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