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In high speed and wideband electronic circuit applications, it is desirable to minimize the cross-talk between parallel tracks on the printed circuit board. This paper presents a technique using vias, with which the cross-talk can be reduced by 50 to 90%. A SPICE model combined with the finite element method is developed to predict the performance and is validated with experimental results.
This paper describes possible applications of finite element method to EMI/C problems. The applications are related to crosstalk problems on printed circuit boards, and calculation of losses on printed circuit board environment.
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