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In recent years there has been an increasing demand of aluminum solder pastes used for automated assembly of LED lighting components, such as heat sinks and supporting frames of LED modules. However, it is well-known that soldering of aluminum and its alloys at low soldering temperatures has long been difficult. In this study, the effects of flux activators (i.e., zinc salt A and B, and tin salt A)...
In order to adapt the harsh service condition of the interconnects between the power semiconductors (chips) and substrates, there is an urgent need to develop alternative interconnect materials. Hybrid silver pastes consisting of microscale Ag flakes, nanoscale or sub-microscale Ag particles and volatile solvents have been considered as one of the most promising candidates. In this study, a hybrid...
Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance...
The air gap of tubular linear motors moves linearly, causing heat transfer states of the motor to alternate repeatedly. Thus, the heat transfer coefficients of the mover inner surface and the stator outer surface vary constantly. In this paper, the combination model of the thermal circuit and temperature field is established to calculate the transient temperature rise of a tubular linear motor with...
The influence of the cooling rate and the type of under bump metallization (UBM, i.e., Cu and Ni) on the undercooling and solidification behavior of Sn-Ag-Cu (SAC) based solders (i.e., Sn-1.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu) and their joints was characterized. The results show that the cooling rate has little influence on the undercooling of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder balls,...
The rapid development of modern electronic devices and products has proposed a great demand for the continuous scaling down in the dimension of solder joints and interconnect pitches in packaging; accordingly the current density in solder interconnects gets higher and higher. The higher current density can easily result in electromigration (EM) which has been regarded as a serious reliability issue...
The morphological evolution of Cu6Sn5 grains formed at the interfaces of “Sn-3.0Ag-0.5Cu/Poly-crystal Cu (PC-Cu)” and “Sn-3.0Ag-0.5Cu/Single crystal Cu (SC-Cu)” under different reflow conditions was investigated. Reflow experiments were performed at different peak temperatures of 230, 260 and 290°C corresponding to the dwelling time of 20s, 60s and 600s, respectively. The results show that Cu6Sn5...
The dissolution of the under bump metallization (UBM) into the molten solder is inevitable during the soldering process. However, overly dissolved UBM can lead to the excessive growth of interfacial intermetallic compound (IMC) and change the solder's composition as well as result in the formation of some bulk IMC in the solder matrix; consequently, mechanical properties of the solder interconnects...
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