The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements...
For decades, advances in integrated circuits (IC) have been driven by continuous scaling down of planar IC technologies. As IC scaling rapidly approaches to technical brick wall, 3D IC heterogeneous integration emerges as a viable solution for future integrated electronics. Future complex system-on-a-chip (SoC) requires high-performance active devices, and novel passive and supporting devices. This...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.