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With the continuous miniaturization of solder joints, the formation of large Ag3Sn plates in Ag containing solders has a detrimental effect on the reliability of solder joints. In the present work, synchrotron radiation real-time in situ imaging technology was used to study the dissolution and precipitation behavior of Ag3Sn plates, as well as the undercooling of Ag3Sn plates and the solder balls,...
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