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Forward-looking intravascular ultrasound (FL-IVUS) transducers are needed to image complex lesions in the coronary arteries, such as chronic total occlusions (CTOs). To achieve 2D and 3D FL-IVUS imaging, transducer arrays can be integrated at the tip of the catheter. However, connecting the elements is challenging due to the limited space available. In this work, we present a FL-IVUS matrix transducer...
Detecting crack type and crack size is crucial for road maintenance and management. Mobile crowd sensing is a new way to collect the information of cracks on roads. We propose a system named CrackDetector to detect cracks and estimate their types and size with smart phone in this paper. The type of a crack (i.e., horizontal crack, vertical crack, net crack) is determined by a coordinate transmission...
This paper presents the methods of eliminating the plasma-induced Si substrate damage in periphery regions, resulting from high aspect ratio etching process for 3D NAND fabrication. The impact of Si substrate damage is verified by the low and high bias power experiments. The result indicates more Si damage is present with high energy bombardment; therefore, high bias power is recommended to be inhibited...
We present several efforts for arcing reduction during high aspect ratio etching. Strategies including pulsing etching adjustments, ex situ multi-cyclic etch approach, flush step incorporation, E-chuck voltage operation, cap material, etc. are explored. The details are discussed in the paper.
Current 2D planar NAND has its limitation for expanding capacity due to the performance and reliability intrinsic characterization will be impacted as device scaling below the 20nm technology node. Such as write bits error, data retention and read disturb, etc. Continued scaling increases the effect of cell-to-cell interference, which widens the program state width. 3D vertical stacking memory cells...
A novel three-dimensional (3D) NAND structure containing both vertical gate (VG) framework and gate-all-around (GAA) cell structure is innovated and demonstrated. It is fabricated on alternating layers of silicon dioxide (OX) and polysilicon (PL) by using 43nm technology. To our knowledge, one of the major advantages of the novel structure is the smaller cell unit footprint than vertical channel (VC)...
Pattern dependent charging effect is explored in this study. Due to increased film thickness in 3D NAND structure, a derivative problem-the plasma-induced charging damage is enhanced during high aspect ratio (HAR) etching. In this paper, several effective methods are demonstrated to alleviate the impact of profile distortion due to charging effect while etching high aspect ratio (>14) trenches.
This paper presents the design, fabrication, and experimental evaluation of a prototype lead zirconium titanate (PZT) matrix transducer with an integrated receive ASIC, as a proof of concept for a miniature three-dimensional (3-D) transesophageal echocardiography (TEE) probe. It consists of an array of $9 \times 12$ piezoelectric elements mounted on the ASIC via an integration scheme that involves...
Transesophageal echocardiography (TEE) involves the use of an ultrasound transducer mounted at the tip of an endoscope to make ultrasonic images of the human heart from the esophagus. In conventional TEE probes, each transducer element is wired-out by a micro-coaxial cable to an external imaging system. To obtain real-time three-dimensional images, however, a two-dimensional transducer array with...
Thickness variations of ILD CMP induced yield loss at wafer edge is simulated by 3D Sentaurus Interconnect, in order to achieve more authentic condition, we adopt the image contour extraction technique to stream the genuine contact contour gds together with STI, POLY, ML database. The results demonstrates that when the thickness is over 7k at wafer edge, there is no electric current found, and it...
Thanks to the advances of data acquisition techniques, we can acquire ventricular blood flow data with very high quality. This extremely complex spatiotemporal data calls for novel visualization and analysis tools. In particular, the new tools need to assist domain experts in quick identification of critical patterns. In this paper, we present a method using topo-logical data analysis tools with simulated...
3D point cloud is the original format of three dimensional map for the navigation of mobile robotics. Time of Fight camera can directly return 3D points and grayscale image simultaneously, but the color information is lost. In this paper, 3D points are colored by calibrating PMD camera with RGB camera, and then the RGB image is generated with respect to a frame of TOF camera. Point cloud form only...
In this paper, the feasibility of building seismic damage assessment using oblique images is discussed. Firstly, some geometric features of buildings are selected and analyzed according to the universal geometric characteristics of most buildings. Secondly, the parameters of each geometric features are calculated by the method of photogrammetry. Finally, the results of parameters calculation are analyzed...
Some new 3D image technologies including image capturing, digital data processing, 2D/3D video conversion, and naked eye 2D/3D compatible display have been developed in Taiwan for the future 3D world applications. An innovative 3D image capturing and displaying architecture is a cost effective system for 3D content generation, transmission, and display. The multiview images of fine art such as sculpture...
Real-time map module is the core module of three-dimensional scene roaming application and often consumes an enormous amount of time and manpower. By summarizing the module features, based on configurable pattern, mask layer recognition and adaptive path finding, this paper presents a customized realtime map framework which can set graphical mark, designate hot spots and generate optimal route without...
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