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In this paper, a small flat-plate vapor chamber was developed to solve hotspot issue in high power electronic packages. The flat-plate vapor chamber was sealed by diffusion bonding technology and its porous wicks were fabricated by sintering copper powder. The transient and steady temperature distributions of the flat plate vapor chamber were experimentally measured. Its performance was compared with...
In this study, the thermal resistance of a typical LED package was analyzed and a compact thermal model (CTM) was obtained by considering the configuration of each layer of LED package. The building of the CTM was presented in detail. Experiments and finite element simulations were conducted to validate the CTM. The error of the thermal resistance obtained by the CTM and simulations were less than...
Effect of the amount of phosphor silicone gel on light extraction efficiency (LEE), correlated color temperature (CCT) and angular color uniformity (ACU) of white light-emitting diode (LED) packaging was investigated by Monte Carlo ray-tracing simulations. The optical model of GaN-based conventional LED chip was identified and the detailed simulation process was presented. It was discovered that the...
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