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In recent years, the 2.5D IC (Integrated Circuit) package with TSV (Through Silicon Vias) has become important for high-bandwidth and high-performance applications. It is well known that 2.5D technology requires significant innovation in the areas of process technology, packaging, design, thermals, and test solutions leading to several hundred new technologies in a single product. With these complex...
Fan-out chip on substrate (FOCoS) is defined as the fan-out package flip-chip mounts on high pin counts ball grid array substrate. 12-inch advanced wafer level package (aWLP) process is implemented on FOCoS for cost saving advantage. The fan-out package constructs from multi-chips with short interconnection between die to die (D2D) by re-distribution layer (RDL) process, which has the potential for...
In this paper, the discolor on back-side revealing through-silicon-via (TSV) after wafer thinning and silicon recess process was investigated with various surface analysis methods. According to the analysis results, surface discolor could be raised by Cu oxidation during Si recess process. To eliminate the discolor occurrence, a remedy with in-situ Ar-ion bombardment was proposed which plays a role...
The through-silicon-via (TSV) technology is one of the most effective approaches to fulfill the form factor, profile, performance, and 3D interconnect demand of next generation handheld and wearable electronics. The TSV technology has been developed into two categories, the TSV Last and the TSV Middle. In this article, we examined a variety of aspects of the two TSV technologies when applied to 3D...
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