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In recent years, the 2.5D IC (Integrated Circuit) package with TSV (Through Silicon Vias) has become important for high-bandwidth and high-performance applications. It is well known that 2.5D technology requires significant innovation in the areas of process technology, packaging, design, thermals, and test solutions leading to several hundred new technologies in a single product. With these complex...
The through-silicon-via (TSV) technology is one of the most effective approaches to fulfill the form factor, profile, performance, and 3D interconnect demand of next generation handheld and wearable electronics. The TSV technology has been developed into two categories, the TSV Last and the TSV Middle. In this article, we examined a variety of aspects of the two TSV technologies when applied to 3D...
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