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Traditional DBT system is hard to accelerate by introducing a customized processor core because the startup overhead is hard to eliminate. In this paper, we concentrate on how to choose a suitable layout of the DBT core in a dual-core system. We analyze the tradeoff between the frequency and the memory bandwidth of the DBT core through an analytical model, and simulated 4 different and usual layouts...
With SES simulation, based on the reduced scale model experiment, the influencing significance degree of the vehicle length, the train speed and the blocking ratio of the tunnel and the train are analyzed In the orthogonal test, the research objects aim at the average air volume, the velocity and the temperature of the units such as the tunnel, the platform, the stairs, the hall and the entrances...
An electro-thermo coupling finite element model for lead free Sn4.0Ag0.5Cu (SAC405) solder ball is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging in the present paper. SAC405 alloy solder ball are commonly used on BGA package and POP package. In this research, a single solder ball (bump) used on flip chip package is established to evaluate...
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