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Mechanical impact or shock resulted from inevitably transport or usage of electronic equipment, may cause great stress and strain in the electronic package, even lead to the failure of electronic equipment, so it's of great significance to explore the mechanical behavior of electronic packaging under drop/impact. In all kinds of package, 3D System in Package with Through Silicon Via has become a hot...
The electromigration (EM) of a solder ball under high-current stressing causes it damage and reduces its service life. Previous studies suggest that the EM life of solder can be improved by properly selecting the solder stress property (compressive or tensile) at the corners where the electron current enters and exits, but complete and relevant research on this proposition is absent. In this paper,...
In this paper, thermal-mechanical reliability of TSV structure was investigated with thermal shock test and finite element method. The fine pitch TSV samples were subjected to thermal load, failure samples were identified by resistance measurement, the calculated characteristic life was about 340 cycles. It is revealed that thermal-mechanical stress is concentrated around TSV, the ends of TSV are...
This paper studies how the underfill with viscoelastic properties impacts the thermal mechanical reliability of a 3D-TSV package system. The Williams-Landel-Ferry equation and the relaxation modulus function in Prony series are used to characterize the viscoelasticity that is both temperature-dependent and time-dependent. The finite element model subjected to a thermal cycle consists of a four-layer...
In this paper, we followed the advice of Prof. Tu to investigate the effect of stress on the electromigration behavior of solder. Static electromigration test and thermal cycle test (−55°C - 125°C) with maximum current density of 2×104A/cm2 were performed. In the fatigue test, it was found that the specimens without electricity had the longest MTTF which suggested electromigration may accelerate failure...
We have developed a micro-infrared photoelastic system to evaluate the stress of through-silicon-vias (TSV). It was found that the stresses of some TSVs increased after thermal cycling, and the scanning electron microscope revealed that those TSVs with stress increased had Cu filler pumped under thermal loading, but no interfacial fracture were observed. Then the annealed samples were heated up to...
Special specimen was designed to study the morphology change of SnAgCu solder under the influence of electromigration (EM) alone. High current stressing was applied to the specimens so that EM of solder would happen at both room and high temperatures. The interfacial crack at cathode is the main failure mode, although the positions of crack maybe different under different temperatures. Localized hillocks...
Special specimen was designed to study the morphology change of SnAgCu solder under the influence of electromigration (EM) alone. High current stressing was applied to the specimens so that EM of solder would happen at both room and high temperatures. The interfacial crack at cathode is the main failure mode, although the positions of crack maybe different under different temperatures. Localized hillocks...
Summary form only given. Lead free 80Au-20Sn solder was widely used in photonics packages and sometimes in electronic packages. As in other cases, mechanical properties of the solder materials is very critical for its reliability evaluation (e.g. fatigue life prediction). However, mechanical properties of this material is not well studied, part of the reason may be the cost. In this paper, steady-state...
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