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The separation state and inhomogeneous nature of microstructure in Sn-Bi based solders can reduce the reliability of solder interconnects obviously. Notably, continuously scaling down of the feature size of solder interconnects may greatly promote the electromigation and segregation of Bi atoms in Cu/Sn-Bi/Cu interconnects under electric current stressing, which will induce the inhomogeneity of the...
Thermomigration issue has attracted increasing attention as it can induce the failure of solder interconnects, owing to the migration of atoms driven by heat flux. Further, thermomigration can promote the formation of microvoids, and also induces the evolution and migration of many other types of microvoids in solder interconnects, resulting in loss of the integrity of solder interconnects and a dramatic...
The migration and segregation of Bi atoms in Cu/Sn-Bi/Cu solder interconnects under electric current stressing usually induce the formation of Bi-riched layers at the anode side, which can cause the failure of solder interconnects easily. In our study, the microstructure evolution of the eutectic Sn-Bi solder in a Cu/Sn-Bi/Cu flip chip solder joint and a right-angle Cu/Sn-Bi/Cu solder interconnect...
Microvoids usually form at the interface between the Sn-based solder and Cu substrate during aging process. The existence and growth (electromigration and coalescence) of the microvoids can decrease the reliability of solder joints, in particular for the joints undergoing electrical current stressing of high density. In this paper, a diffuse interface model is employed to simulate the morphological...
Among the lead-free solders used in the electronic industry, Sn-Bi based alloys have been largely considered for low temperature soldering applications due to low melting-point feature and good wettability resulting from Bi addition which can reduce the surface tension of liquid solders and lower the reaction speed between Sn and Cu. In this paper, the phase field simulation method was adopted to...
The phase field method was applied to study the microstructure evolution of Ni 4 Ti 3 precipitates during stress-free and stress-assisted aging of bi-crystalline NiTi shape memory alloys (SAMs) with two different initial Ni-contents of 51.5% and 52.5% (mole fraction), respectively. The simulation results show that, during stress-free aging of the NiTi alloy with a low supersaturation...
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