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Creep deformation and fracture behavior of solder joints with a constant diameter (300 µm) and the decreasing joint thickness (from 300 to 25 µm) under electro-thermo-mechanical coupled loads were characterized using a dynamic mechanical analyzer assembled with a DC power source. The results show that the feature of creep curves of solder joints remains unchanged with the decreasing joint thickness,...
Creep behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different thicknesses under electric current stressing was studied in comparison with those without current stressing. The effect of current stressing on creep mechanism was characterized by calculation of the stress exponent (n) of the steady-state creep rate and fractographic analysis of fractured joints. Results show that creep curves...
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