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Mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy, before and after isothermal aging at 100 °C for 200 h, were investigated. Results show that the grain coarsening occurs in the Sn-58Bi solder alloy with prolonging the isothermal aging time, and the lamellar microstructure of the Sn-58Bi alloy is changed, in which the Bi-rich phase exhibits network-like morphology...
Based on the size effect on solidification behavior of lead-free solders, we propose a novel method to prepare solder joints with the metallurgical bonding between the undercooled liquid solder and Cu metallization under the temperature lower than the solder's melting point. The interfacial reaction and growth behavior of intermetallic compound (IMC) between the undercooled liquid Sn-3.0Ag-0.5Cu solder...
Isothermal aging effect on the microstructure and mechanical properties of line-type Ni/Sn3.0Ag0.5Cu/Ni sandwich structure interconnects with small heights of 50 and 25 μm was investigated in this study. Microstructural analysis showed that interfacial (Ni, Cu)3Sn4 IMC layer grew thick after aging at 125 °C for 100 h with the formation of local voids and cracks due to volume shrinkage induced by the...
The microstructural evolution and mechanical behavior of line-type Ni/Sn3.0Ag0.5Cu/Ni interconnects with a small thickness (or height) of 100 µm during isothermal aging were investigated. Microstructural analysis shows that both (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 IMC phases formed at the interface of the as-reflowed joints; however, after the aging treatment at 125 °C for 100 h or more, the interfacial (Cu,Ni)...
The dissolution of the under bump metallization (UBM) into the molten solder is inevitable during the soldering process. However, overly dissolved UBM can lead to the excessive growth of interfacial intermetallic compound (IMC) and change the solder's composition as well as result in the formation of some bulk IMC in the solder matrix; consequently, mechanical properties of the solder interconnects...
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