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Based on the size effect on solidification behavior of lead-free solders, we propose a novel method to prepare solder joints with the metallurgical bonding between the undercooled liquid solder and Cu metallization under the temperature lower than the solder's melting point. The interfacial reaction and growth behavior of intermetallic compound (IMC) between the undercooled liquid Sn-3.0Ag-0.5Cu solder...
During soldering process employing Sn-based lead-free solders, an intermetallic compound (IMC) layer forms between the molten solder and pad/under bump metallization (UBM), whose morphology and thickness play an important role in controlling the service performance of the solder joints, in particular for solder interconnects with the decreasing size where the interfacial IMC layer takes up a high...
Isothermal aging effect on the microstructure and mechanical properties of line-type Ni/Sn3.0Ag0.5Cu/Ni sandwich structure interconnects with small heights of 50 and 25 μm was investigated in this study. Microstructural analysis showed that interfacial (Ni, Cu)3Sn4 IMC layer grew thick after aging at 125 °C for 100 h with the formation of local voids and cracks due to volume shrinkage induced by the...
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