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Some recent studies on radio-frequency (RF) and free-space optical (FSO) dual-mode communication are reported. A novel hybrid packaging is proposed to integrate RF/FSO front-end circuits on a single compact PCB by sharing space and structural components. Full-wave electromagnetic simulation was applied to design RF and predict coupling between RF and optical circuits. A hybrid RF/FSO package design...
The development of a new hybrid packaging method is reported, where the front end radio frequency (RF) element, namely a modified quasi-Yagi antenna, is integrated with an optical transmitter and an optical receiver on single PCB for dual-mode, i.e. RF/free space optical communication. The VCSEL and the pin diode are placed on the antenna directors to share the common metal pads on the Duroid (RT...
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