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This paper presents new results on integrated devices for radio and free-space optical dual-mode communication. Two novel hybrid packaging schemes using two different microwave printed antenna designs are presented for the integration of radio-optical front-end circuits on a planar compact printed circuit board with shared electrical and structural components. Full-wave electromagnetic (EM) simulations...
Some recent studies on radio-frequency (RF) and free-space optical (FSO) dual-mode communication are reported. A novel hybrid packaging is proposed to integrate RF/FSO front-end circuits on a single compact PCB by sharing space and structural components. Full-wave electromagnetic simulation was applied to design RF and predict coupling between RF and optical circuits. A hybrid RF/FSO package design...
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