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Interconnections in semiconductor devices need to provide a seamless electrical, thermal, and mechanical link to different parts of the circuit. Since the move away from lead-based solders due to toxicity concerns, the search has been on for materials that can provide desirable attributes before, during, and after bonding. While lead-free solders have been extensively used as a replacement, they are...
The non-isothermal preoxidation of the titania/ferrous oxide solution (TFOS) was investigated between 300°C and 1200°C. To explore the TFOS preoxidation mechanism, the phase transitions, crystal structure behavior, subreactions, and atomic-scale migration and enrichment of the TFOS during preoxidation were studied. Two different titanium and iron solutions were distinguished by scanning electron microscopy...
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