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A 3-D ring oscillator integrated with through silicon vias (TSVs) is designed and fabricated for testing multilayer stacked integrated circuits with TSV. The proposed 3-D ring oscillator consists of 13 stages. 65-nm CMOS dies with two current-starved inverter and via-last TSVs are designed for the five middle layers of 3-D ring oscillator. The two cascaded inverters are connected to the up-side layer...
The performance of two high precision frequency-stability measurement systems, analog beat method time-interval analyzer, has been compared with digital beat method systems developed at the National Time Service Center. In this paper, the digital beat method system is a measuring technique that uses a multi-channel beat note digital analyzer in place of the time interval counter. This technique uses...
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