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Testing for three dimensional (3D) integrated circuits (ICs) based on through-silicon-via (TSV) is one of the major challenges for improving the system yield and reducing the overall cost. The lack of pads on most tiers and the mechanical vulnerability of tiers after wafer thinning make it difficult to perform 3D Known-Good-Die (KGD) test with the existing 2D IC probing methods. This paper presents...
Due to the high integration on vertical stacked layers, power/ground network design becomes one of the critical challenges in 3D IC design. With the leakage-thermal dependency, the increasing on-chip temperature in 3D designs has serious impact on IR drop due to the increased wire resistance and increased leakage current. Power/ground (P/G) TSVs can help to relieve the IR drop violation by vertically...
Due to the increased power density and lower thermal conductivity, 3D is faced with heat dissipation and temperature problem seriously. Previous researches show that leakage power and delay are both relevant to temperature. The timing-power-temperature dependence will potentially negate the performance improvement of 3D designs. TSV (Through-Silicon-Vias) has been shown as an effective way to help...
3D multi-processor system-on-chip (3D MPSoC) can integrate more PUs together with shorter interconnection using vertical interconnection. It's very important to analyze the power ground (P/G) noise induced by power gating in low power 2D MPSoC. Actually, 3D MPSoC will be more sensitive to P/G noise due to the vertical interconnection between different PUs. So the P/G noise induced by power gating...
Three dimensional integrated circuits (3D ICs) are currently being developed to improve existing 2D designs by providing smaller chip areas and higher performance and lower power consumption. However, before 3D ICs become a viable technology, the 3D design space needs to be fully explored and 3D EDA tools need to be developed. To help explore the 3D design space and help fill the need for 3D EDA tools,...
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