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In this paper, a CPW-fed antenna-in-package (AiP) operating at millimeter wave (mmWave) based on a wafer-level packaging technology with through silicon via (TSV) interconnections is proposed, designed, and measured. The designed antenna consists of two-stacked high-resistivity silicon (HRSi) substrates. One is the bottom HRSi substrate with thickness of 750 , which carries the slot radiator...
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