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New System-in-Package (SiP) with innovative Wafer-Level-System-Integration (WLSI) technologies that leverage foundry core competence on wafer processes have been demonstrated. The WLSI technologies include Chip-on-Wafer-on-Substrate (CoWoSTM) 3DIC and interposer, Integrated Fan-Out (InFO) and Chip-Scale Wafer-Level-Packaging. Wide application portfolio from very low I/O pin-count, low-cost devices,...
TSV (Through Silicon Via)-based interposer has been proposed as a multi-die package solution to meet the rapidly increasing demand in inter-component (e.g. CPU, GPU and DRAM) communication bandwidth in an electronic system. he stacked-silicon die package configuration may give rise to package reliability concerns not observed in conventional monolithic flip-chip packages. 3D finite element method...
A novel air gap (AG) structure is integrated into TSV formation to achieve high performance interconnects for 3D stacking of 28nm CMOS devices. When benchmarked against conventional TSVs, the most prominent advantages of this novel TSV structure demonstrated reduced capacitance, minimized TSV-induced stress and, hence, reduced keep-out zone (KOZ) for CMOS devices. Our FEM simulation confirms that...
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