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As electronic devices become lighter, thinner, shorter, and smaller, IC packages follow. Low-profile type packages are reduced in thickness, so the stiffness of thin type packages is weaker due to the thermo-mechanical effects of manufacturing processes, testing, and operations. Due to the different temperatures in those processes, and the differences in coefficient thermal expansion (CTE) of each...
Based on the combination of the genetic and Levenberg-Marquardt algorithms, a new method is developed to perform both local and global parameter extraction for the PSP MOSFET model. It has been successfully used to extract parameter sets for a 65-nm technology node. Numerical examples demonstrate its ability to obtain highly accurate model parameter values without excessive computational cost.
First the surface-potential-based compact MOS model, PSP, is introduced. After a discussion of the general advantages of this model, it is benchmarked against measurements from the 45 nm technology node. Finally, we zoom in on the modeling in PSP of two effects that are of special importance for RF applications: distortion and noise.
The spline-collocation-based non-quasi-static model is extended to include small-geometry effects and to enable both small-signal and large-signal simulations. The new NQS model has been implemented into circuit simulators using both SP and PSP models and verified using RF test data. Additional verification is provided by comparison with the results of numerical simulations and with the MM11 channel...
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