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Accurate modeling and estimation of 3-D power network electrical performance are vitally important to aid 3-D integration and packaging design. This paper, for the first time, combines the electromagnetic (EM) simulation program with integrated circuit emphasis simulations to evaluate the electrical performance of a 3-D power network, which consists of Cu through-silicon-vias (TSVs), solders, micro-solders,...
Decoupling capacitors are essential to reduce high transient current noise and to provide a low impedance power delivery path. 3D technology has several advantages for power delivery, and this work investigates the impacts of decoupling capacitors on through-silicon-via (TSV)-based 3D power networks using a novel hybrid modeling approach, i.e., combining electromagnetic (EM) and SPICE simulations...
It is important to understand how to deliver power into 3D heterogeneous systems, which require different power supplies for different components (e.g., digital, analog, mixed-signal, MEMS parts). This paper reports on a study for a simplified case, where the two power supplies with different voltage levels are uniformly distributed through a TSV-based 3D system. In addition to intrinsic voltage losses...
While three-dimensional (3D) technology has several advantages for power delivery, an integrated chip-level, interposer-level, and package-level power distribution network in through-silicon-via (TSV)-based 3D system has to be modeled and evaluated. This paper reports on modeling of power delivery into 3D chip stacks on a silicon interposer/packaging substrate using a novel hybrid approach, i.e.,...
Conventional power delivery methods for microprocessors and high-performance ASICs have fundamental limitations in meeting the power requirements of future IC technologies due to large interconnect parasitics. A new three-dimensional (3D) power delivery approach along with a cellular power supply architecture is proposed as a possible solution to the problems of conventional 2D power delivery. Different...
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