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Silver (Ag) bond wires are increasingly used in semiconductor components to replace gold (Au) bond wires, and applications for these components are expanding from consumer to high-reliability electronic systems. To assess the impact of this technology transition on the overall component reliability, extended reliability testing beyond the typical JEDEC component qualification testing is needed. Additionally,...
One of the critical challenges faced by the mainstream data mining community is to make the mined patterns or knowledge actionable. Knowledge is considered actionable if users can take direct actions based on such knowledge to their advantage. Among the most important and distinctive actionable knowledge are actionable behavioral rules that can directly and explicitly suggest specific actions to take...
Nowadays an increasing number of companies only deploy their enterprise application services over the Internet. Software as a Service (SaaS) in a cloud computing environment allows these companies to focus on providing more competitive services instead of maintenance. As delivery of computing as a service, a trustworthy cloud service widely depends upon its reliability. For this reason, a newly defined...
The transitions to copper (Cu) from gold (Au) bond wires is occurring for an increasingly broader range of semiconductor components. For ball grid array (BGA) packages, key packaging materials including molding compound and substrate all need to be re-evaluated as they may interact with Cu wire bond differently from Au wires and introduce new failure mechanisms. In this work, we investigate the impact...
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