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As the trend of smaller mobile electronic products, smaller solder balls are needed for electronic packages such as chip scale package (CSP). The purpose of this study was to investigate the effect of solder ball sizes on the interfacial reaction and their joint reliability. In this study, 400, 300, and, 200 μm diameter solder balls of 98.5 wt.% Sn, 1 wt.% Ag, and 0.5 wt.% Cu(SAC105) were reflowed...
In this study, board level drop shock and TC reliabilities in terms of solder materials and UBM (under bump metallurgy) structures have been evaluated to suggest optimal structures of WLP (wafer level packaging) with the large die, high pin counts for mobile application. Test vehicles of WLP have been designed with 5.6??5.6 mm die size, 340 um thickness (including backside protection film), 14??14...
To satisfy the requirements of the newest mobile product, smaller solder ball is needed for electronic packages such as chip scale package (CSP). The purpose of this study was to investigate the effect of solder ball size on the interfacial reaction. In this study, 400, 300, and, 200 ??m diameter solder balls of 98.5 wt.% Sn, 1 wt.% Ag, and 0.5 wt.% Cu(SAC105) were formed on the Cu/OSP and electroplated...
In this study, the package named Bumpless Ball Grid Array (BBGA) was developed. In BBGA package, chips were buried in the cavities made with solder resist materials. For BBGA package development, epoxy based photo-patternable solder resist was used as an encapsulation material because of cost effectiveness and process simplicity. This solder resist film was laminated on the Cu plate and cavities were...
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