The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
To meet the requirements of the next high generation high-performance networking switches and routers, system integration based on the Three-dimensional (3D) System-in-Package (SiP) technology is being studied and developed. In this paper, we report the development of a 3D SiP using the organic interposer technology. A 3D SiP is designed and manufactured with a large size organic interposer with fine-pitch...
The bandwidth for high performance networking switches and routers increases two to ten times in every new generation. This in turn drives the bandwidth requirements for the Application Specific Integrated Circuits (ASICs) and their external memory devices designed for the high performance network systems. 3D IC integration with its low power, high density and high bandwidth advantages is proposed...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.