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Over the last decade we developed methods for the fabrication of laser-structured electrode arrays for neural engineering. For these electrode arrays a metal foil was structured with a 1064 nm Nd:YAG laser in the nanosecond pulse regime and placed within a silicone rubber substrate. Due to process restrictions the individual electrode sites are not in plane with the upper layer of the silicone rubber...
In this paper, we introduce a technique for double-sealed ceramic packages for the long-term protection of implanted electronics against body fluids. A sequential sealing procedure consisting of a first step, during which the package is sealed with epoxy, protecting the implant electronics from aggressive flux fumes. These result from the application of the actual moisture barrier which is a metal...
We investigated the morphological and electrochemical properties of an explanted laser-machined 32 channel electrocorticogram (ECoG) electrode array made of platinum-iridium and silicone rubber. It was connected to a wireless brain-computer interface (BCI) and implanted in a sheep for more than 15 months. Recordings and stimulations of cortical activity were conducted over the whole period on a regularly...
We developed an implantable wireless, hermetically sealed brain-computer interface which is intended to stay functional within the body for decades. Such an ambitious task demands interconnection technologies of high reliability and reproducibility. Investigating soft-soldering, poor wetting behavior of SnAg solder and destructive influences of additional fluxing materials excluded the lead-free compound...
In the past we developed a method for the fabrication of neural electrodes based on laser-structuring metal foil to form tracks and electrode sites within a silicone rubber substrate. Here, this process was refined by an additional coating of the laser-patterned metal tracks to improve their mechanical properties. Parylene C has been found to be the coating material of choice due to excellent electrical...
Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina...
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