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Pure Sn solder balls of initial diameter of 2 mm, having been reflow soldered on Cu substrate at 573.15 K for 1, 2 and 5 min, were subjected to furnace cooling. Upon the start of reflow, the initially spherical solder balls underwent a rapid radial spreading and wetting on Cu substrate and thus attained non-spherical geometry with a maximum height at the center whereas a minimum one at the periphery...
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