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Sintered Ag is well known for die-attach materials, suitable for Ag metalized interfaces with a self-healing function of generated cracks. A remaining risk of sintered Ag bonding may be possible degradation of interfacial strength at high temperatures. Molding process is thus important for supporting the die-attach in the encapsulated power module once certain adhesion strength is assured between...
This research focuses on revealing the effect of size and shape of Ag particles for mechanical properties of no-pressure sintered Ag by using micro-compression test. Specimens were fabricated by focused ion beam with the dimension of 5 μm × 5 μm × 15 μm. The stress-strain curve suggested that the sintered Ag subjected a stable elastic deformation and a large plastic deformation. The mechanical properties...
We have investigated finite element method (FEM) modeling of thermal stress analysis in a SiC power module using sintering Ag die-attach, and explored the reliability focusing on the initial cracking point caused by the thermal stress. The analysis results by FEM models support our experimental observations in the reliability tests of the fabricated modules, confirming that using direct-bonded-copper...
The mechanical properties of sintered porous Ag-paste are investigated by tension test and shear test in the temperature range from 25 °C to 300°C. Stress-strain curves of sintered porous Ag-paste are measured at different temperatures. The Poisson's ratio, which is calculated by Young's modulus and shear modulus, decreased from 0.31 at 25 °C to 0.11 at 300 °C. In addition, 3D finite element model...
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