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To study the relation between the QFP lead-free solder stress and strain accumulation under the condition of the impact of temperature (-55??C~125??C), Visco-plastic finite element model based upon Anand constitutive equations is established to numerically analyze the interfacial stress of solder formed by three different kinds of solders to the same substrate FR-4. The results shows that the interface...
Under the condition of uniaxial strain(Amplitude is plusmn0.025%), the elastic-plastic finite element method was used to analyze the bonding of conductive/copper wire. The result shows that the plastic strain of X and Y direction is mainly occurred at two positions: one is at the left arc side; the other is at the right arc side of the department. The maximum value of the von Mises equivalent stress...
The effect of stress on the microstructure and properties of an Al-Cu-Mg-Ag alloy under-aged at 165 °C for 2 h during thermal exposure at 200 °C was investigated. The tensile experimental results show that the remained tensile strength of both specimens at room temperature after being exposed at 200 °C with and without applying stress rises firstly, and then drops with the increasing of exposure time...
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