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A SiP(System in Package) consists of multiple chips stacked and connected within a package. And SiP testing is a significant and growing problem owing to the limited accessibility and its particular test flow. It requires individual chip-level, interconnections test, post-packaging test and final system testing. This paper presents an overview of SiP test flow and the problem encountered by SiP test,...
A SiP(System in Package) consists of multiple chips stacked and connected within a package. And SiP testing is a significant and growing problem owing to the limited accessibility and its particular test flow. It requires individual chip-level, interconnections test, post-packaging test and final system testing. This paper presents an overview of SiP test flow and the problem encountered by SiP test,...
The ever-increasing circuit density and performance of integrated circuit bring the improvement of design difficulty. Edge-interconnect of SIP technology can reduce the design complexity and system size, improve system reliability and performance. This paper presents a CPU packaging configured with three-dimensionally (3D) integrated SRAM, Flash and some peripheral chips. Signal communication between...
The ceaseless drive to produce cheaper and better products has compelled the Semiconductor Industry to continue to innovate. Because of its priority that chips or dies of different techniques can be integrated in a package, SIP (System In Package) is applied more and more widely in the embedded control system. At the same time, the test of SIP has also been a big challenge owing to the amount constraint...
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