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Power electronics has a great popularity in many industrial fields. Recently, in automotive industrial fields, the number of demand on electrical vehicles has been extremely rising. Those devices are required to have high thermal performance. However, conventional power device packages using wire are difficult to match that. So we have developed a new and expectable advanced package for power devices...
We present a new embedded package structure and technology for the next generation of WLP, the Wafer level Fun-Out Package; WFOP™. That is one of the face-down mounting styles, which has metal plate like stainless or copper as a base plate of redistributed interconnection layer. The redistributed layer is fabricated with semi-additive method of copper plating. The contact type between the die pads...
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