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In this study, interfacial reaction of SAC/FeNi solder joints is investigated, and the Cu-rich IMC was clarified according to scanning electron microscopy (SEM) and transmission electron microscopy (TEM) observations. At SAC/27Fe73Ni interface, Cu rich IMC is rod-like dispersing in the solder. On the other hand, at the interface of SAC/55Fe45Ni solder joints, Cu rich IMC has an island-shape. From...
The intermetallic compound (IMC) formed between eutectic SnIn solder and single crystalline Cu substrate during reflow and solid-state aging was investigated precisely utilizing electron microscope. Two kinds of crystal structures with different morphologies were identified, which are Cu(In,Sn) 2 at the solder side and the Cu 2 (In,Sn) at the Cu substrate side. The Cu(In,Sn) 2...
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