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The high temperature storage test (HTST) was conducted on the SnAgCu/Ni-W-P and Ni-Fe solder joints. While the conventional Ni-P solder joints were used as comparison to study the diffusion barrier effect of Ni-W-P and Ni-Fe under bump metallization (UBM). Both cross section and top view for the microstructural evolution of solder joints during 150°C aging were observed by the scanning electron microscope...
The high temperature storage test (HTST) was conducted on the SnAgCu/Fe-Ni solder joints. The microstructural evolution during aging at 125°C was observed by both Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM). During the reflow process, FeSn2 layer and rod-like (Cu,Ni)6Sn5 grains were formed. During the aging at 125°C, dispersed (Cu,Ni)6Sn5 with two distinct morphologies...
The growth mechanism of duplex structural Cu 2 (In,Sn) compound formed between eutectic SnIn solder and single crystalline Cu during reflowing and solid-state aging were systematically investigated using a top-view technique. The fine-grain Cu 2 (In,Sn) had a granular morphology and distributed homogeneously without any growth orientation, while textured coarse-grain Cu 2 (In,Sn)...
Chip scale packaging (CSP) samples with Fe-Ni UBM barrier layer were successfully fabricated by actual process. Solid interfacial reactions between SAC105 and three kinds of Fe-Ni UBM barrier layers of different composition had been investigated to clarify the phase evolution of Fe-Ni/SAC solder joints. Microstructural investigation revealed that after reflow only a thin FeSn2 layer was formed on...
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