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Hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding with different bonding temperature are analyzed in this work. The investigation consists of two parts: hermetic seal study using helium bomb test and mechanical support study using four-point bending method. The wafer pairs are bonded at 250, 300 and 350 °C, respectively, under a bonding force of 5,500 N for a...
AbstractIn this paper, a new process to fabricate an electromagnetic stepping micromotor using surface sacrificial layer technology (SSLT) is illustrated, and the SEM photo of the stepping micromotor is showed. The torque of the stepping micromotor with maximum torque of 60Nm is directly calculated by using electromagnetics laws and the law of conservation of energy. The stator and the shaft and the...
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