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Frequency and time domain models are developed for backplane (BP), printed circuit board (PCB), and silicon interposer (SI) links using six-port transfer matrices (ABCD matrices) for bumps, vias and connectors, and coupled multiconductor transmission lines for traces. The six-port transfer matrix approach enables easy computation of the transfer function, as well as near-end and far-end crosstalk...
In this paper we present a compact model for analysis of 3D chip-to-chip interconnect pathways consisting of planar transmission lines, vias, package and pin discontinuities. The model accurately captures signal losses for a wide frequency spectrum with very small error when compared with HSPICE circuit simulations. The interconnect pathway is optimized for maximum bandwidth density and minimum energy-per-bit...
Ground tracks are normally inserted between high-speed signal interconnects to make them immune to crosstalk. It is seen that the intermediate ground tracks (insertions) effectively reduce crosstalk and signal overshoots and ringing, and it is a common design practice to ensure better signal integrity. The paper aims at developing a formal approach toward determining the equivalent capacitance and...
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