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In this paper, we report the performance improvement obtained in side-contact multilayer Graphene nanoribbon (SC-MLGNR) interconnects by using intercalated AsF5. We compare it with that of traditional Cu interconnects as well as undoped (or neutral) SC-MLGNRs for both local/intermediate and global interconnect applications, at 6 nm technology node. We present a qualitative analysis of the effect of...
In this paper we present a compact model for analysis of 3D chip-to-chip interconnect pathways consisting of planar transmission lines, vias, package and pin discontinuities. The model accurately captures signal losses for a wide frequency spectrum with very small error when compared with HSPICE circuit simulations. The interconnect pathway is optimized for maximum bandwidth density and minimum energy-per-bit...
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